Spectraforce Technologies
PWB Designer, Staff|7177
Spectraforce Technologies, San Diego, California, United States, 92154
Title: PCB / PWB Designer, SrWork Location: San Diego, CA 92121Work Requirement: HybridShift Time: 7:30am - 4:00pmDuration: 11 Months
Hit Apply below to send your application for consideration Ensure that your CV is up to date, and that you have read the job specs first.Summary:The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G & 6G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).
Top 5 Required Skills12+ years actively involved in PWB design for high-density electronics packaging.10+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages.Experience working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT.
Education Requirement* Associate's degree in a Technical Field, Electronics preferred.
TechnologiesSiemens/Mentor XpeditionPADS and/or Cadence Allegro PWB design software
Years of Experience Requirement* 10
Preferred Skills:Knowledge of large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals.Mastery in digital processors, RF and radio circuits as well as power control devices.Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .35 mm pitch and smaller packages.Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.Preferred design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, LPDDR5, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE.Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.Effectively multitasks and meets aggressive schedules in a dynamic environment.Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWB's that meet schedule objectives.Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.Participate and provide input into process improvement, PWB and DFM checklists and guidelines.Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.Experience working with various EMI mitigation techniques and practices.Experience with IDF/EMN file exchange between mechanical and HW teams.Understands project goals and individual contribution toward those goals.Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.Prepare and deliver design reviews to project team.Possess excellent verbal and written communication skills.Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.
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Hit Apply below to send your application for consideration Ensure that your CV is up to date, and that you have read the job specs first.Summary:The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G & 6G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).
Top 5 Required Skills12+ years actively involved in PWB design for high-density electronics packaging.10+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs.Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages.Experience working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT.
Education Requirement* Associate's degree in a Technical Field, Electronics preferred.
TechnologiesSiemens/Mentor XpeditionPADS and/or Cadence Allegro PWB design software
Years of Experience Requirement* 10
Preferred Skills:Knowledge of large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals.Mastery in digital processors, RF and radio circuits as well as power control devices.Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .35 mm pitch and smaller packages.Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.Preferred design experience: RF, Analog, High-speed digital circuits - DDR2, 3 & 4, LPDDR5, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE.Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.Effectively multitasks and meets aggressive schedules in a dynamic environment.Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWB's that meet schedule objectives.Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.Participate and provide input into process improvement, PWB and DFM checklists and guidelines.Participates in determining objectives of assignment and plans, schedules, and arranges own activities in accomplishing objectives.Experience working with various EMI mitigation techniques and practices.Experience with IDF/EMN file exchange between mechanical and HW teams.Understands project goals and individual contribution toward those goals.Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.Prepare and deliver design reviews to project team.Possess excellent verbal and written communication skills.Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.
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