FIB/SEM Engineer

TITLE: FIB/SEM ENGINEER FLSA STATUS: EXEMPT REPORTS TO: MANAGER, WAFER CHARACTERIZATION SUMMARY: Under the direction of the Manager of Wafer Characterization, the FIB/SEM Engineer performs physical characterizations and materials/failure analyses of product devices using state-of-the-art analytical FIB/SEMs, prepares sophisticated TEM lamella samples, analyzes results, summarizes findings, and supports the development of new designs, processes, or materials for magnetic recording heads, MRAM, or other devices. This position is in Milpitas, California. ESSENTIAL FUNCTIONS: Prepares sophisticated TEM lamella samples using different FIB/SEMs to support TEM analyses Performs device cross-section imaging and metrology through high-resolution SEM/STEM imaging Performs materials/failure analysis using different advanced analytical FIB/SEMs attached with EDS, EBSD and ToF-SIMS Performs device structure analysis and failure analysis using FIB/SEM 3D tomography Actively participate in developing new recipes to improve the consistency and efficiency of sample preparation. Works with other team mates on developing new techniques for sophisticated metrology and device/material failure analysis Proactively responds to issues related to materials quality or the characterization process and initiates resolution Reviews and analyzes data, creates reports, and presents findings to panels, groups, teams, or departments as required Interacts and responds to inquiries from other product groups regarding process-related issues and product or device requirements Adheres to all safety policies and procedures as required Performs other duties of a similar nature or level* MINIMUM QUALIFICATIONS: Masters or PhD degree in Materials Science, Chemical Engineering, or Physics or a Bachelors degree and three years of equivalent experience Significant hands-on experience in TEM lamella sample preparation and in-depth understanding of FIB/SEM instrument fundamentals Strong interest in metrological, materials and failure analyses for the advancement of magnetic recording technology using knowledge and skills of different materials analysis techniques. Proficient in the use of Microsoft Office Applications Knowledge, Skills, and Abilities: Proficient in the fundamental understandings of FIB/SEM, EDS, EBSD, 3D tomography Knowledge and ability to prepare TEM lamella samples, design and conduct experiments, interpret complex data, and recommend correction action Good fundamental understanding or hands-on experience in TEM, STEM, EDS, EELS Knowledge of semiconductor or basic HDD industry principles, practices, and techniques Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations Able to independently create reports, presentations, and written analysis summaries Strong ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management Demonstrated ability to understand and carryout complex instructions given verbally or in writing Able to work productively and collaboratively with all levels of employees and management Able to comply with all safety policies and procedures Demonstrated organizational and time management skills Demonstrated problem-solving and trouble shooting skills Flexible and able to prioritize The annual base salary for this full-time position is between $96,655.00-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically. WORKING CONDITIONS: The FIB/SEM Engineer will work primarily in a quiet and clean laboratory environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Frequently works in a laboratory environment; wears a lab coat, gloves, and other safety equipment; spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds. *Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting. TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.