Apolis
PWB Designer in San Diego, CA
Apolis, San Diego, California, United States, 92189
APOLIS2024
Title: Staff PWB Designer Location: San Diego, CA Duration: 10+ Months
Candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and client design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G & 6G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).
Required Skills
05+ years actively involved in PWB design for high-density electronics packaging. 05+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs. Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages Experience working include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT
Title: Staff PWB Designer Location: San Diego, CA Duration: 10+ Months
Candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to design and document printed wiring board layouts that conform to manufacturing and industry standards and client design guidelines. Working in close coordination with electrical and mechanical design teams from supplied schematics and electrical and mechanical design constraints to develop PWB layouts that meet all project goals and requirements for a variety of new 5G & 6G designs across multiple business units (R&D, Mobile, Compute, IOT, Infrastructure, Automotive, Test Equipment).
Required Skills
05+ years actively involved in PWB design for high-density electronics packaging. 05+ years' experience in a PWB design role designing consumer-grade mobile products or low volume test products utilizing latest generation processor chips & ICs. Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages Experience working include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem, Auto, Compute, Infrastructure and IOT