3D Glass Solutions, Inc.
3D Glass Solutions, Inc. | Radio Frequency Design Engineer
3D Glass Solutions, Inc., Albuquerque, New Mexico, United States
Job/Position Summary
Design state-of-the-art RF/microwave components, modules, front-ends, and SiP’s using 3DGS innovative glass technology. Responsible for solving major and complex engineering problems in one or more phases of a developmental project involving analysis, research design, development, fabrication and/or testing of a device or system. You will own end-to-end RF module design from initial definition through production. The candidate selected must have the ability to perform the essential duties and responsibilities with minimal supervision.
Primary Responsibilities
Design integrated passive devices such as filters, multiplexers, couplers, and baluns. Develop multi-chip RF modules for 3DHI (3D heterogeneous integration) applications. Design high frequency interposers for MMICs including internal matching and transmission lines. Apply microwave engineering and RFIC design fundamentals to the integration of active devices such as power amplifiers, low noise amplifiers into glass SiP modules. Evaluate new advanced packaging technology, including design and validate prototypes. Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of various RF modules/SIPs. Desired experience with multi-technology assembly and circuit-EM co-simulation. Excellent analytical skills required. Must possess excellent communication skills with ability to exchange information and interface effectively with customers clearly and concisely. Create test procedures, technical white papers and participate in technical proposal writing. Previous experience in product engineering in high volume manufacturing desired. Perform additional functions and other duties as assigned or required.
Requirements
Bachelor’s degree in electrical engineering required. Master’s degree in electrical engineering preferred. Minimum of 5 years of RF design experience required. 10 years preferred. This position will require lawful access to ITAR/EAR and CUI controlled information and employees in these roles will need to meet those requirements. Requirements may include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements. Occasional travel up to 10% may be required.
Knowledge, Skills, and Abilities
Strong RF fundamentals such as impedance matching, active/passive RF device modeling, resonant circuits, and RF/wireless communication systems Expert using ADS or AWR design tools Hands on lab experience and debugging with RF test equipment, probe stations, assembly. Experience with antennas and phased array desired Strong desire and commitment to take product from concept to volume production Must be a highly motivated, self-driven, goal-oriented individual
Physical/Working Requirements
Within a manufacturing environment, must be able to follow rules and wear personal protective equipment (PPE) as applicable. Expected to work in a safe manner in accordance with established operating procedures and practices.
Behavioral Traits
Excellent leadership and communication skills is must A strong focus on accuracy and precision for identifying issues and ensuring that quality standards are met. A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments. The ability to work well with others, fostering a cooperative atmosphere, driving quality initiatives and engaging all levels of the organization.
Design state-of-the-art RF/microwave components, modules, front-ends, and SiP’s using 3DGS innovative glass technology. Responsible for solving major and complex engineering problems in one or more phases of a developmental project involving analysis, research design, development, fabrication and/or testing of a device or system. You will own end-to-end RF module design from initial definition through production. The candidate selected must have the ability to perform the essential duties and responsibilities with minimal supervision.
Primary Responsibilities
Design integrated passive devices such as filters, multiplexers, couplers, and baluns. Develop multi-chip RF modules for 3DHI (3D heterogeneous integration) applications. Design high frequency interposers for MMICs including internal matching and transmission lines. Apply microwave engineering and RFIC design fundamentals to the integration of active devices such as power amplifiers, low noise amplifiers into glass SiP modules. Evaluate new advanced packaging technology, including design and validate prototypes. Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of various RF modules/SIPs. Desired experience with multi-technology assembly and circuit-EM co-simulation. Excellent analytical skills required. Must possess excellent communication skills with ability to exchange information and interface effectively with customers clearly and concisely. Create test procedures, technical white papers and participate in technical proposal writing. Previous experience in product engineering in high volume manufacturing desired. Perform additional functions and other duties as assigned or required.
Requirements
Bachelor’s degree in electrical engineering required. Master’s degree in electrical engineering preferred. Minimum of 5 years of RF design experience required. 10 years preferred. This position will require lawful access to ITAR/EAR and CUI controlled information and employees in these roles will need to meet those requirements. Requirements may include US Citizenship, US Permanent Resident, or ability to meet contract-specific licensure requirements. Occasional travel up to 10% may be required.
Knowledge, Skills, and Abilities
Strong RF fundamentals such as impedance matching, active/passive RF device modeling, resonant circuits, and RF/wireless communication systems Expert using ADS or AWR design tools Hands on lab experience and debugging with RF test equipment, probe stations, assembly. Experience with antennas and phased array desired Strong desire and commitment to take product from concept to volume production Must be a highly motivated, self-driven, goal-oriented individual
Physical/Working Requirements
Within a manufacturing environment, must be able to follow rules and wear personal protective equipment (PPE) as applicable. Expected to work in a safe manner in accordance with established operating procedures and practices.
Behavioral Traits
Excellent leadership and communication skills is must A strong focus on accuracy and precision for identifying issues and ensuring that quality standards are met. A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments. The ability to work well with others, fostering a cooperative atmosphere, driving quality initiatives and engaging all levels of the organization.