Vortexlink, Inc.
High Speed Board Designer
Fulltime opportunity in Campbell, CA
We are seeking a highly skilled and innovative High-Speed Board Designer to join our team focused on cutting-edge AI chip development. In this role, you will design, develop, and optimize high-performance printed circuit boards (PCBs) that meet the demanding requirements of AI accelerators and computing systems.
Key Responsibilities
· PCB Design: Design high-speed, multi-layer PCBs for AI chip systems, including power delivery networks, signal integrity, and thermal management.
· High-Speed Interfaces: Develop and optimize high-speed interfaces such as PCIe, DDR, GDDR, HBM2E, Ethernet, and SerDes for maximum performance and reliability.
· Simulation and Analysis: Perform signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) simulations using tools like HyperLynx, Ansys HFSS, Sigrity or equivalent.
·· Component Selection: Evaluate and select components, including connectors, capacitors, and inductors, suitable for high-frequency applications.
· Testing and Validation: Conduct prototype testing, debugging, and validation to ensure compliance with specifications and standards.
Qualifications
Required:
· Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
· Proven experience in high-speed PCB design (minimum 16 layers).
· Proficiency in PCB design tools like Cadence Allegro, Altium Designer, or similar platforms.
· Strong knowledge of high-speed design principles, including impedance control, crosstalk, and skew management.
· Hands-on experience with SI/PI simulation tools and methodologies.
· Familiarity with power delivery systems for high-performance chips.
· Knowledge of industry standards such as JEDEC, IEEE, and PCIe specifications.
Fulltime opportunity in Campbell, CA
We are seeking a highly skilled and innovative High-Speed Board Designer to join our team focused on cutting-edge AI chip development. In this role, you will design, develop, and optimize high-performance printed circuit boards (PCBs) that meet the demanding requirements of AI accelerators and computing systems.
Key Responsibilities
· PCB Design: Design high-speed, multi-layer PCBs for AI chip systems, including power delivery networks, signal integrity, and thermal management.
· High-Speed Interfaces: Develop and optimize high-speed interfaces such as PCIe, DDR, GDDR, HBM2E, Ethernet, and SerDes for maximum performance and reliability.
· Simulation and Analysis: Perform signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) simulations using tools like HyperLynx, Ansys HFSS, Sigrity or equivalent.
·· Component Selection: Evaluate and select components, including connectors, capacitors, and inductors, suitable for high-frequency applications.
· Testing and Validation: Conduct prototype testing, debugging, and validation to ensure compliance with specifications and standards.
Qualifications
Required:
· Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
· Proven experience in high-speed PCB design (minimum 16 layers).
· Proficiency in PCB design tools like Cadence Allegro, Altium Designer, or similar platforms.
· Strong knowledge of high-speed design principles, including impedance control, crosstalk, and skew management.
· Hands-on experience with SI/PI simulation tools and methodologies.
· Familiarity with power delivery systems for high-performance chips.
· Knowledge of industry standards such as JEDEC, IEEE, and PCIe specifications.