Senior Product Lead – BEOL Marketing & Advanced Packaging
Intellisoft Technologies - Santa Clara, California, us, 95053
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Senior Product Lead – BEOL Marketing & Advanced Packaging
Intellisoft Technologies provided pay range
This range is provided by Intellisoft Technologies. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more. Base pay range
$110.00/hr - $120.00/hr Direct message the job poster from Intellisoft Technologies Strategic Hiring Partner | IT & Semiconductor Recruitment | Workforce Planning | AI-Driven Talent Acquisition
Seeking a Senior Product Lead with deep expertise in BEOL semiconductor processes, marketing, and applications. This role will drive strategy, product positioning, and customer engagement for advanced packaging solutions such as chiplet integration, HBM, and substrate technologies. Ideal candidates bring 10+ years in semiconductor design or packaging, strong cross-functional leadership, and the ability to translate market needs into BEOL-focused product innovations. Job Title : Senior Product Lead – BEOL Marketing & Advanced Packaging Duration : 12+ Months Contract (with extension potential) Key Responsibilities Lead strategy and roadmap for BEOL (Back-End-Of-Line) marketing and product applications within advanced semiconductor packaging. Serve as the primary technical interface between marketing, customers, and internal engineering teams for BEOL technologies. Translate customer needs and market trends into BEOL-focused product requirements, performance targets, and application guidelines. Drive innovation in advanced packaging solutions (chiplet integration, HBM, LPDDR, substrate technologies), with specific focus on BEOL process impacts and enablement. Provide technical leadership in BEOL design enablement, materials selection, and integration strategies to meet reliability, performance, and manufacturability goals. Partner with FEOL and packaging design teams to ensure cohesive end-to-end solutions that address market and application needs. Guide development and integration of mixed-signal and chiplet-based architectures, emphasizing BEOL interfaces and interconnect solutions. Contribute to thermal and signal integrity analysis, particularly in high-density BEOL routing and interposer technologies. Represent the company in customer engagements, technical forums, and industry conferences as a thought leader in BEOL applications and market trends. Collaborate with product marketing to position BEOL capabilities and application benefits across the semiconductor value chain. Mentor junior engineers and application specialists, nurturing expertise in BEOL-centric product development. Required Qualifications M.S. in Electrical Engineering, Materials Science, or related field (Ph.D. preferred). 10+ years of experience in semiconductor electronics, advanced packaging, or ASIC development, with significant emphasis on BEOL applications and marketing. Proven track record in BEOL process integration, product application definition, and market alignment. Expertise in substrate technologies, interconnect materials, high-speed I/O, and chiplet-based packaging. Deep understanding of thermal, signal, and power integrity challenges in BEOL-centric designs. Familiarity with EDA and simulation tools relevant to BEOL layout, verification, and application modeling. Excellent communication, stakeholder engagement, and leadership skills, with ability to interface across technical and business functions. Let me know if you are available and interested in the above position. Meanwhile you can refer someone who might be interested for this role. Seniority level
Seniority level Mid-Senior level Employment type
Employment type Contract Job function
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