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Primary Responsibilities• Passive structure designs such as baluns, filters, phase shifter with EMX/Momentum• Work with cross-functional groups on EVKit/load-board designs to optimize performance• Custom-SPI/I3C/MIPI development – work with cross-functional groups within IDT to design & verify digital interfaces• Custom package development – Work together with packaging group to develop custom packages and perform 3D Modeling throughout the design phase.• Learn, on the job, the breadth of the group’s product development cycle and apply that knowledge to lead projects through the engineering development stage• Design transmit/receive architectures and circuits• Perform studies on how to improve standard library elements – ESD clamps, IO buffers and bias controllers – to further enhance the quality and reliability of products. Design and layout peripherals, such as ESD, IO Buffers, and bias controllers. Validate improvements once they return from fab.• Collaborate with lead engineers to diagnose and correct circuit flaws in new and existing products. Perform in-depth peer reviews to determine weak links within circuit architectures and advise on how to improve.• Manage and share detailed technical results and proactively support cross-functional groups involved with the productQualifications• BSEE, MSEE or PhD preferred• 10+ years of industrial RF/Analog IC design and development experience or equivalent• Solid understanding of RF parameters such as S-parameters, NF, P1dB, IP3, IMD, stability• Fluent in RFIC design using ADS and Cadence Spectre RF design suite• Fluent in the following EM tools: Momentum, EMX, and HFSS• Strong hands-on experience using RF test equipment and characterizing RF ICs• Must be able to work both independently and together in a team environment• Solid organizational skills with attention to details• Good communication, presentation skills and effective team work• Curious and aspires to overcome design challenges – driven to succeed personality

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