Xenter
Principal Analog/Mixed Signal Circuit Designer
Xenter, San Jose, California, United States, 95199
Xenter is a technology in medicine company that is bringing medical devices to the digital age. Xenter is revolutionizing medicine by developing and launching smart/wireless guidewires and catheters that transmit data through a proprietary wireless network to our proprietary cloud that houses real time Physical Intelligence medical data.
Reports to: VP, Semiconductor Technology
Location: San Francisco Bay Area or Salt Lake City
Salary Range: $180K to $250K
Overview:
You will be the senior member of the ASIC team responsible for designing and verifying pressure sensing and ultrasound imaging systems for medical applications. You will architect the state-of-art acoustic sensing systems and design the ASIC chips to realize them. You will be expected to take high level user requirements and create a realizable system that meets these goals. This will include high level modeling of proposed solutions, along with creating detailed specifications of the requirements. This is a highly cross-functional role, and you will work with others to identify critical aspects of how the design will interact with the overall product.
Responsibilities:•Work closely with the system architects to design world-class capacitive micromachined ultrasound transducer chips and IP blocks, which meet performance, power and area targets.•Provide leadership to the ASIC design team to safeguard the success of the ASIC designs.•Engage with cross-functional analog, digital, firmware, software, system architecture, technology, packaging, production test, and other teams to implement the new circuits and sub-systems and optimize the performance and power consumption.•Design analog ASIC circuits, including TIA, Pulser, ADC etc. for CMOS back plane of capacitive micromachined ultrasound transducers with specifications from the imaging system.•Develop and run high-level simulations to validate top-level integration•Master specification budgets of larger building blocks and sub-systems.•Assist testing team in developing testing methods, defining test-plans, and analyzing results.•Assist with debug and bring-up.
Minimum Experience:•Extensive experience on conceptualizing, designing, evaluating, and taking to production analog and mixed-signal circuits and sub-systems for sensing and measurement.•In-depth knowledge in analog mixed signal circuit design for MEMS ultrasound transducer, including analog circuit block design for ADC/DAC, TIA, Pulser, bandgap and other references, biasing circuits, LDO regulators, amplifiers comparators, switched-cap circuits, oscillators, filters, etc.•Solid understanding of and experience with precision analog design techniques including feedback and compensation, chopping, multifaceted element matching, frequency planning, trimming/calibration, and real-time adaptive algorithms•Hands-on experience in system-level design, requirements documentation, and IC architecture definition of complex mixed-signal ASICs•Deep knowledge of device physics as it applies to semiconductor devices and manufacturing technology•IC or test IC tape out experience is preferred.•Excellent skills in analog design tool simulation (spice, etc).•Experience in working with production test engineers to develop and validate test plans and design for testability details•Strong problem-solving skills and be able work in a fast paced collaborative environment. Be able to adapt to priority and task change quickly. Focus on details and getting tasks to completion. Independently explore new innovative ideas.•Excellent written and verbal communication skills and solid teamwork skills.
Minimum Education:•PhD or Master degree in Electrical Engineering (Analog/Digital Signal Processing/Circuit Design) or related field.
#J-18808-Ljbffr
Reports to: VP, Semiconductor Technology
Location: San Francisco Bay Area or Salt Lake City
Salary Range: $180K to $250K
Overview:
You will be the senior member of the ASIC team responsible for designing and verifying pressure sensing and ultrasound imaging systems for medical applications. You will architect the state-of-art acoustic sensing systems and design the ASIC chips to realize them. You will be expected to take high level user requirements and create a realizable system that meets these goals. This will include high level modeling of proposed solutions, along with creating detailed specifications of the requirements. This is a highly cross-functional role, and you will work with others to identify critical aspects of how the design will interact with the overall product.
Responsibilities:•Work closely with the system architects to design world-class capacitive micromachined ultrasound transducer chips and IP blocks, which meet performance, power and area targets.•Provide leadership to the ASIC design team to safeguard the success of the ASIC designs.•Engage with cross-functional analog, digital, firmware, software, system architecture, technology, packaging, production test, and other teams to implement the new circuits and sub-systems and optimize the performance and power consumption.•Design analog ASIC circuits, including TIA, Pulser, ADC etc. for CMOS back plane of capacitive micromachined ultrasound transducers with specifications from the imaging system.•Develop and run high-level simulations to validate top-level integration•Master specification budgets of larger building blocks and sub-systems.•Assist testing team in developing testing methods, defining test-plans, and analyzing results.•Assist with debug and bring-up.
Minimum Experience:•Extensive experience on conceptualizing, designing, evaluating, and taking to production analog and mixed-signal circuits and sub-systems for sensing and measurement.•In-depth knowledge in analog mixed signal circuit design for MEMS ultrasound transducer, including analog circuit block design for ADC/DAC, TIA, Pulser, bandgap and other references, biasing circuits, LDO regulators, amplifiers comparators, switched-cap circuits, oscillators, filters, etc.•Solid understanding of and experience with precision analog design techniques including feedback and compensation, chopping, multifaceted element matching, frequency planning, trimming/calibration, and real-time adaptive algorithms•Hands-on experience in system-level design, requirements documentation, and IC architecture definition of complex mixed-signal ASICs•Deep knowledge of device physics as it applies to semiconductor devices and manufacturing technology•IC or test IC tape out experience is preferred.•Excellent skills in analog design tool simulation (spice, etc).•Experience in working with production test engineers to develop and validate test plans and design for testability details•Strong problem-solving skills and be able work in a fast paced collaborative environment. Be able to adapt to priority and task change quickly. Focus on details and getting tasks to completion. Independently explore new innovative ideas.•Excellent written and verbal communication skills and solid teamwork skills.
Minimum Education:•PhD or Master degree in Electrical Engineering (Analog/Digital Signal Processing/Circuit Design) or related field.
#J-18808-Ljbffr