Micron Technology, Inc
Director - HBM Design
Micron Technology, Inc, Folsom, California, United States, 95630
Our vision is to transform how the world uses information to enrich life for
all .
Take the next step in your career now, scroll down to read the full role description and make your application.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.We are seeking a visionary Director in our HBM Design Engineering team within the Heterogeneous Integration Group (HIG). This role is pivotal in pioneering end-to-end solutions that revolutionize both front-end and back-end processes in high-performance memory systems, delivering increased bandwidth, capacity, and reduced latency across memory and storage solutions. We are at the forefront of designing next-generation HBM memory systems that are integral to accelerated computing and the burgeoning fields of Machine Learning (ML) and Artificial Intelligence (AI).As the Director of the HBM Design Team, you will lead a group of innovative engineers specializing in the design and development of next-generation HBM memory systems tailored for accelerated computing systems and ML (Machine Learning) & AI (Artificial Intelligence) workloads. You will be part of a highly multi-functional team of technical subject matter experts collaborating closely with a world-wide team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability, and quality for Micron’s HBM product portfolio.Key Responsibilities:Strategic Leadership : Guide a team of exceptional engineers in crafting next-gen HBM memory systems for ML & AI workloads. Oversee project planning, execution, and manage schedule risks and priorities. Drive the vision, strategy, and roadmap for HBM products.
Collaborative Excellence : Work with a global consortium of Design Engineering, Product Engineering, Process Development, and Business Units to fulfill our ambitious HBM roadmap.
Innovative Design : Utilize your expertise in advanced computing architectures, memory interface & control, and high-speed interface design to identify bottlenecks and devise state-of-the-art solutions.
Team Development : Cultivate a culture of continuous learning and innovation, mentoring engineers and overseeing project execution.
Technical Prowess : Engage with customers & key stakeholders to define and customize next-gen HBM architecture, focusing on memory controllers, processor IPs, and high-speed interfaces like UCIe.
What sets you apart:Minimum of 10+ years of experience in a system architecture role.
Experience leading custom SoC/ASIC design and understanding of memory hierarchy, controller, and PHYs. Experience with high-efficiency architectures and designs.
Experience with CMOS circuit transistor/gate-level design, RTL design, and verification.
Knowledge in AI technologies, architectures, various DRAM technologies, and advanced semiconductor packaging.
Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.
Excellent communication, presentation, and interpersonal skills.
Ability to work independently and collaboratively in a fast-paced and dynamic environment.
Experience managing, mentoring, and guiding engineering teams.
Passion for innovation and continuous learning.
Education:BS/MS in Computer Engineering with a minimum of 15 years of relevant experience.
The US base salary range that Micron Technology estimates it could pay for this full-time position is: $194,000.00 - $340,000.00Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure, and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses, and equity.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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all .
Take the next step in your career now, scroll down to read the full role description and make your application.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.We are seeking a visionary Director in our HBM Design Engineering team within the Heterogeneous Integration Group (HIG). This role is pivotal in pioneering end-to-end solutions that revolutionize both front-end and back-end processes in high-performance memory systems, delivering increased bandwidth, capacity, and reduced latency across memory and storage solutions. We are at the forefront of designing next-generation HBM memory systems that are integral to accelerated computing and the burgeoning fields of Machine Learning (ML) and Artificial Intelligence (AI).As the Director of the HBM Design Team, you will lead a group of innovative engineers specializing in the design and development of next-generation HBM memory systems tailored for accelerated computing systems and ML (Machine Learning) & AI (Artificial Intelligence) workloads. You will be part of a highly multi-functional team of technical subject matter experts collaborating closely with a world-wide team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability, and quality for Micron’s HBM product portfolio.Key Responsibilities:Strategic Leadership : Guide a team of exceptional engineers in crafting next-gen HBM memory systems for ML & AI workloads. Oversee project planning, execution, and manage schedule risks and priorities. Drive the vision, strategy, and roadmap for HBM products.
Collaborative Excellence : Work with a global consortium of Design Engineering, Product Engineering, Process Development, and Business Units to fulfill our ambitious HBM roadmap.
Innovative Design : Utilize your expertise in advanced computing architectures, memory interface & control, and high-speed interface design to identify bottlenecks and devise state-of-the-art solutions.
Team Development : Cultivate a culture of continuous learning and innovation, mentoring engineers and overseeing project execution.
Technical Prowess : Engage with customers & key stakeholders to define and customize next-gen HBM architecture, focusing on memory controllers, processor IPs, and high-speed interfaces like UCIe.
What sets you apart:Minimum of 10+ years of experience in a system architecture role.
Experience leading custom SoC/ASIC design and understanding of memory hierarchy, controller, and PHYs. Experience with high-efficiency architectures and designs.
Experience with CMOS circuit transistor/gate-level design, RTL design, and verification.
Knowledge in AI technologies, architectures, various DRAM technologies, and advanced semiconductor packaging.
Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.
Excellent communication, presentation, and interpersonal skills.
Ability to work independently and collaboratively in a fast-paced and dynamic environment.
Experience managing, mentoring, and guiding engineering teams.
Passion for innovation and continuous learning.
Education:BS/MS in Computer Engineering with a minimum of 15 years of relevant experience.
The US base salary range that Micron Technology estimates it could pay for this full-time position is: $194,000.00 - $340,000.00Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure, and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses, and equity.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.
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