Northrop Grumman
Principal / Senior Principal Microelectronic Packaging Mechanical Design Enginee
Northrop Grumman, Baltimore, Maryland, United States, 21206
Principal / Senior Principal Microelectronic Packaging Mechanical Design Engineer Requisition ID: R10170567
Location:
Baltimore, Maryland, United States of AmericaClearance Type:
SecretTelecommute:
Yes-May consider hybrid teleworking for this positionShift:
Days (United States of America)Travel Required:
Yes, 10% of the TimeRelocation Assistance:
Relocation assistance may be availableNorthrop Grumman Mission Systems is seeking a Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.
Learn more about the general tasks related to this opportunity below, as well as required skills.Overview:You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production.This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher and contract award.Roles and Responsibilities include:Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.Providing technical leadership and mentoring to less experienced personnel.Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 9 years of applied experience in lieu of degree requirement.U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.Proficient with AutoCAD.Familiarity with NX or other 3D modeling software.Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 13 years of applied experience in lieu of degree requirement.U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.Proficient with AutoCAD.Familiarity with NX or other 3D modeling software.Preferred Qualifications:Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.Active DoD Secret Clearance or higher.Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.Familiarity with thermal and structural analysis considerations, methodologies, and software tools.Experience with hands-on assembly and testing of prototype electronic hardware.Experience in a technical leadership role on a cross-functional product development team.This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:401kEducational AssistanceLife InsuranceEmployee Assistance Programs & Work/Life SolutionsNorthrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.
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Location:
Baltimore, Maryland, United States of AmericaClearance Type:
SecretTelecommute:
Yes-May consider hybrid teleworking for this positionShift:
Days (United States of America)Travel Required:
Yes, 10% of the TimeRelocation Assistance:
Relocation assistance may be availableNorthrop Grumman Mission Systems is seeking a Principal / Senior Principal Mechanical Electronic Packaging Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland.
Learn more about the general tasks related to this opportunity below, as well as required skills.Overview:You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM and communications systems. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production.This position may be filled as a Principal Mechanical Electronic Packaging Engineer or a Senior Principal Mechanical Electronic Packaging Engineer.This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher and contract award.Roles and Responsibilities include:Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.Providing technical leadership and mentoring to less experienced personnel.Basic Qualifications for Principal Mechanical Electronic Packaging Engineer:Bachelor’s degree with 5 years of experience, a Master’s degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 9 years of applied experience in lieu of degree requirement.U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.Proficient with AutoCAD.Familiarity with NX or other 3D modeling software.Basic Qualifications for Senior Principal Mechanical Electronic Packaging Engineer:Bachelor’s degree with 8 years of experience, a Master’s degree with 6 years of experience or a PhD with 3 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields. Will consider 13 years of applied experience in lieu of degree requirement.U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs.Proficient with AutoCAD.Familiarity with NX or other 3D modeling software.Preferred Qualifications:Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.Active DoD Secret Clearance or higher.Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices.Familiarity with thermal and structural analysis considerations, methodologies, and software tools.Experience with hands-on assembly and testing of prototype electronic hardware.Experience in a technical leadership role on a cross-functional product development team.This positions standard work schedule is a 9/80. The 9/80 schedule allows employees who work a nine-hour day Monday through Thursday to take every other Friday off.As a full-time employee of Northrop Grumman Mission Systems, you are eligible for our robust benefits package including:401kEducational AssistanceLife InsuranceEmployee Assistance Programs & Work/Life SolutionsNorthrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.
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