Senior Quantum Thin Film Engineer
Microsoft Corporation - Redmond, Washington, United States, 98052Work at Microsoft Corporation
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Overview
OR Bachelor's degree in Materials Science, Electrical Engineering, Physics or related field AND 5+ years experience in industry or in a research and development environmentOR Master's degree in Materials Science, Electrical Engineering, Physics or related field AND 3+ years experience in industry or in a research and development environmentOR Doctorate degree in Materials Science, Electrical Engineering, Physics or related field.
Proficient in semiconductor physics, device fabrication, and crystal chemistry.Competent in using various analytical and metrology tools.Other RequirementsAbility to meet Microsoft, customer and/or government security screening requirements are required for this role.These requirements include, but are not limited to the following specialized security screenings:Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide proof of citizenship, U.S. permanent residency, or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information.
To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.Additional or Preferred Qualifications:Experimental lab work. Experience with installing or maintaining complex equipment.Statistics Coursework, Statistical Process Control (SPC) or Design of Experiments (DOE) principles.Familiarity with Thin Film Deposition techniques.Semiconductor processing fundamentals (lithography, wet etch, dry etch, chemical and or mechanical polishing, etc.).Materials and physical device characterization (SEM, TEM, etc.) and fundamentals of semiconductor device testing.Data analysis skills with demonstrated ability to construct clear data-based problem statements.Experience with data analysis software (MATLAB, Python, JMP, etc.), scripting, and data visualization.Successful mentorship to less experienced engineers and technicians.Experience in foundry operations is highly desirable.Excellent problem-solving skills and attention to detail.Hardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $112,000 - $218,400 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $145,800 - $238,600 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-payMicrosoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances.
We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.#quantumConduct research to improve thin film deposition processes for dielectric, metal, and superconducting materials.Collaborate with the engineering team to integrate new thin film deposition processes into existing manufacturing operations.Ensure all thin film deposition processes meet industry standards and safety regulations.Document all thin film deposition procedures and results in a clear and concise manner.Collaboration with our quantum measurement physicists to determine which performance metrics for our quantum transport devices are most affected by our deposition processes. Perform iterative improvements to these processes to improve device functional metrics.Coordinate thin film deposition tools downtime with the on-site equipment engineer and forecast consumable needs or required modifications to the tools.OtherEmbody ourCultureandValues