Principal AnalogMixed Signal Circuit Designer
Xenter - San Jose, California, United States, 95199Work at Xenter
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Overview
Reports to: VP, Semiconductor Technology
Location: San Francisco Bay Area or Salt Lake City
Salary Range: $180K to $250K
Overview:
You will be the senior member of the ASIC team responsible for designing and verifying pressure sensing and ultrasound imaging systems for medical applications. You will architect the state-of-art acoustic sensing systems and design the ASIC chips to realize them. You will be expected to take high level user requirements and create a realizable system that meets these goals. This will include high level modeling of proposed solutions, along with creating detailed specifications of the requirements. This is a highly cross-functional role, and you will work with others to identify critical aspects of how the design will interact with the overall product.
Responsibilities:
· Work closely with the system architects to design world-class capacitive micromachined ultrasound transducer chips and IP blocks, which meet performance, power and area targets.
· Provide leadership to the ASIC design team to safeguard the success of the ASIC designs.
· Engage with cross-functional analog, digital, firmware, software, system architecture, technology, packaging, production test, and other teams to implement the new circuits and sub-systems and optimize the performance and power consumption.
· Design analog ASIC circuits, including TIA, Pulser, ADC etc. for CMOS back plane of capacitive micromachined ultrasound transducers with specifications from the imaging system.
· Develop and run high-level simulations to validate top-level integration
· Master specification budgets of larger building blocks and sub-systems.
· Assist testing team in developing testing methods, defining test-plans, and analyzing results.
· Assist with debug and bring-up.
Minimum Experience:
• Extensive experience on conceptualizing, designing, evaluating, and taking to production analog and mixed-signal circuits and sub-systems for sensing and measurement.
• In-depth knowledge in analog mixed signal circuit design for MEMS ultrasound transducer, including analog circuit block design for ADC/DAC, TIA, Pulser, bandgap and other references, biasing circuits, LDO regulators, amplifiers comparators, switched-cap circuits, oscillators, filters, etc.
• Solid understanding of and experience with precision analog design techniques including feedback and compensation, chopping, multifaceted element matching, frequency planning, trimming/calibration, and real-time adaptive algorithms
• Hands-on experience in system-level design, requirements documentation, and IC architecture definition of complex mixed-signal ASICs
• Deep knowledge of device physics as it applies to semiconductor devices and manufacturing technology
• IC or test IC tape out experience is preferred.
• Excellent skills in analog design tool simulation (spice, etc).
• Experience in working with production test engineers to develop and validate test plans and design for testability details
• Strong problem-solving skills and be able work in a fast paced collaborative environment. Be able to adapt to priority and task change quickly. Focus on details and getting tasks to completion. Independently explore new innovative ideas.
• Excellent written and verbal communication skills and solid teamwork skills.
Minimum Education:
• PhD or Master degree in Electrical Engineering (Analog/Digital Signal Processing/Circuit Design) or related field.
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