Thin Film Process Engineer
Western Digital - Fremont, California, United States,![Western Digital](/api/image?src=https%3A%2F%2Fgeneral-board-default.s3.us-east-2.amazonaws.com%2Fpublic%2Fimages%2Fdesk-360x180.webp&w=640&q=75&f=webp)
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Overview
We are seeking a highly motivated candidate to join our thin film process group.
In this role, the candidate will work as a Thin Film Process Engineer at WD’s wafer fab in Fremont, CA.
The candidate will support R&D Heat Assisted Magnetic Recording (HAMR) team for fast deployment to MFG to improve the HAMR cycle time in ion beam etch (IBE), ion beam deposition (IBD) and Anelva (ANEL) areas. This is an opportunity to work for future products.
ESSENTIAL DUTIES AND RESPONSIBILITIES
Involve with R&D team to develop robust HAMR related IBE/IBD and ANEL magnetic and non-magnetic thin film and multi-layers process to improve device reliability, prevent defects, reduce Within Wafer (WIW) and Wafer to Wafer (WTW) variation and optimizing processes to improve wafer yield.
Attending HAMR related process development and cycle time meetings
Transfer the newly developed HAMR process to production.
Setup recipes and automation process control (APC) system for manufacturing team to run.
Sustain the process performance.
Review processing data, wafer disposition, flag process excursions, conduct failure analysis (FA) and provide solution.
Able to work collaboratively with R&D, design, integration, equipment, and IT teams.
Support fab production 24/7, including taking immediate action with fab issues.